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SCHEDA PRODOTTO
Cod./Produtt.: SYS-F619P2-RC0/SYS-F619P2-RC0
Produttore: SUPERMICRO
Descrizione: 4U FAT Twin - 8 SET OF: Dual Xeon Scalable Proc. (LGA3647), 6x2,5" SAS Hot Swap, 12xDDR4 ECC-R up to 1,5TB , 1xSATA DOM, 6x SAS3 (2 SAS3 + 4 opt. NVMe U.2), SAS3 with Broadcom 3008, IPMI 2.0 + KVM with LAN, Exp. Slot: 1xPCIe x16 LP, 1 x Flexible Net
SPECIFICHE TECNICHE

F619P2-RC0




Integrated Board
Super X11DPFR-SN
 
Key Features
8 Hot-plug System Nodes in 4U
Each node supports:


1. Dual socket P (LGA 3647) supports
    Intel® Xeon® Scalable Processors,
    Dual UPI up to 10.4GT/s

2. Up to 1.5TB ECC 3DS LRDIMM, up to
    DDR4-2666MHz; 12 DIMM slots

3. Expansion slots: 1 PCI-E 3.0 x16 (LP)
    1 PCI-E 3.0 x16 (for SIOM )

4. 6 Hot-swap 2.5" SAS3/SATA3 or 2
    Hot-swap 2.5" SAS3/SATA3 +
    4 optional NVMe U.2

5. SAS3 via Broadcom 3008 6. SIOM Network card, 1 dedicated IPMI LAN port 7. 1 VGA, 2 USB 3.0 ports
8. 3x 4cm 20k RPM middle fans
9. 2200W Redundant Power Supplies
    Titanium Level (96% Efficiency)
 

Product SKUs
SYS-F619P2-RC0
  • SuperServer F619P2-RC0 (Black)
 
Motherboard

Super X11DPFR-SN
 
Processor/Cache
CPU
  • Dual Socket P (LGA 3647)
  • Intel® Xeon® Scalable Processors,
    Dual UPI up to 10.4GT/s
  • Support CPU TDP 70-165W with IVR
Cores
  • Up to 28 Cores with Intel® HT Technology
 
System Memory
Memory Capacity
  • 12 DIMM slots
  • Up to 1.5TB ECC 3DS LRDIMM, 1.5TB ECC RDIMM, DDR4 up to 2666MHz
Memory Type
  • 2666/2400/2133MHz ECC DDR4 SDRAM
 
On-Board Devices
Chipset
  • Intel® C621 chipset
SAS
  • SAS3 (12Gbps) via Broadcom 3008
Network Controllers
  • Flexible networking via SIOM
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Graphics
  • ASPEED AST2500 BMC
 
Input / Output (per node)
SAS
  • 6 SAS3 (12Gbps) ports
NVMe
  • 4 NVMe U.2 option
LAN
  • SIOM flexible Network card
  • 1 RJ45 Dedicated IPMI LAN port
USB
  • 2 USB 3.0 ports (rear)
VGA
  • 1 VGA port
 
System BIOS
BIOS Type
  • 128Mb SPI Flash EEPROM with AMI BIOS
 
Management
Software
Power Configurations
  • ACPI Power Management
 
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory.
  • 4+1 Phase-switching voltage regulator
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 4U Rackmount
Model
  • CSE-F418BC2-R2K20BP
 
Dimensions and Weight
Width
  • 17.63" (448mm)
Height
  • 6.96" (177mm)
Depth
  • 29" (737mm)
Package
  • 28.3" (W) x 15.0" (H) x 42.4" (D)
Weight
  • Net Weight: 150 lbs (68.04 kg)
  • Gross Weight: 200 lbs (90.71 kg)
Available Colors
  • Black
 
Front Panel
Buttons
  • Power On/Off button
  • UID button
LEDs
  • Power status LED
  • Hard drive activity LED
  • Network activity LEDs
  • Information LED (UID, Fan failure, Overheat)
 
Expansion Slots (per node)
PCI-Express
  • 1 PCI-E 3.0 x16 (Low-profile)
  • 1 PCI-E 3.0 x16 (SIOM)
 
Drive Bays (per node)
Hot-swap
  • 6 Hot-swap 2.5" SAS3/SATA3 or 2 Hot-swap 2.5" SAS3/SATA3 + 4 optional NVMe U.2
M.2
  • M.2 Support
 
Backplane
1 SAS/SATA backplane
 
System Cooling (per node)
Fans
  • 3x 4cm 20k RPM middle fans
 
Power Supply
2200W Redundant Power Supplies with PMBus
Total Output Power and Input
  • 1200W with Input 100-127Vac
  • 1800W with Input 200-220Vac
  • 1980W with Input 220-230Vac
  • 2090W with Input 230-240Vac
  • 2200W with Input 220-240Vac (for UL/cUL use only)
  • 2090W with Input 230-240Vdc (for CCC only)
AC Input Frequency
  • 50-60Hz
Dimension
(W x H x L)
  • 76 x 40 x 336 mm
+12V
  • Max: 100A / Min: 0A (100-127Vac)
  • Max: 150A / Min: 0A (200-220Vac)
  • Max: 165A / Min: 0A (220-230Vac)
  • Max: 174.17A / Min: 0A (230-240Vac)
  • Max: 183.3A / Min: 0A (220-240Vac)
5VSB
  • Max: 1A / Min: 0A
Output Type
  • Backplanes (gold finger)
Certification Titanium Level96%  UL/cUL/CB/BSMI/CE/CCC
  Titanium Level
  [ Cert. in progress ]
 
Operating Environment
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature:
       -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity:
       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
       5% to 95% (non-condensing)
 
Parts List - (Items Included)
 
Part Number
Qty
Description
Motherboard / Chassis MBD-X11DPFR-SN
CSE-F418BC2-R2K20BP
8
1
Super X11DPFR-SN Motherboard
4U Chassis
Backplane BPN-ADP-8S3008-1UF 8 BPN-ADP-8S3008-1UF
Backplane BPN-ADP-X11DPFR 8 Power distribution board for X11DPFR-S(N)
Backplane BPN-SAS3-F418-B6N4 8 6-Port Hybrid Backplane Supports 2x2.5” SAS3/SATA3 HDD/SDD and 4x2.5” SAS3/SATA3/NVMe Storage Devices for FatTwin Platform
Cable 1 CBL-0486L 16 2x2 to 2x2 15cm power cable HF. 18AWG
Cable 2 CBL-OTHR-0022L 8 20 to 20 pin cable for BPN-ADP-F418LS,7.5cm, 28AWG,RoHS/REACH,PBF
Cable 3 CBL-SAST-0697 16 MINI SAS HD,12G,INT,6CM,30AWG
Riser Card RSC-RR1U-E16 8 RSC-RR1U-E16 with PIC-E x16 output
Heatsink / Retention SNK-P0067PS 8 1U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism
Heatsink / Retention SNK-P0067PSM 8 1U Passive CPU Heat Sink with a 26-mm Wide Middle Air Channel for X11 Purley Platform Equipped with a Narrow Retention Mechanism
Power Supply PWS-2K20A-1R 4 1U 2200W Redundant, Titanium, 76(W) X 40(H) X 336(L) mm

 
Optional Parts List
  Part Number Qty Description
Cable CBL-SAST-1002-1 - 4/node to enable NVMe
Software SFT-OOB-LIC 1 OOB Management Package (per node license)
Software SFT-DCMS-Single 1 DataCenter Management Package (per node license)