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BAREBONE / Server Xeon LGA3647 / SYS-2029TP-HTR

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SCHEDA PRODOTTO

Cod./Produtt.: BBS6835/SYS-2029TP-HTR
Produttore: SUPERMICRO
Descrizione: 2U Twin Pro - 4 SET OF: Dual Xeon Scalable Proc. (LGA3647), 6x2,5" Hot Swap, 16xDDR4 ECC-R up to 2TB , 1xSATA DOM, 6x SATA3, IPMI 2.0 + KVM with LAN, Exp. Slot: 2xPCIe x16 LP, Flexible Networking support via SIOM Card, Red. 2200W Titanium Lev. HE (9

SPECIFICHE TECNICHE

2029TP-HTR

Integrated Board

Super X11DPT-PS

Key Features
- Compute Intensive Application
- HPC, Data Center
- Enterprise Server
- Financial Analysis
- Mission-critical applications

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

1. Dual socket P (LGA 3647) supports
    Intel® Xeon® Scalable Processors,
    Dual UPI up to 10.4GT/s
2. Up to 2TB ECC 3DS LRDIMM, up to
    DDR4-2666MHz; 16 DIMM slots
3. 2 PCI-E 3.0 x16 slots
4. Flexible Networking support via SIOM;
    Dedicated IPMI 2.0 LAN
5. 6 Hot-swap 2.5" SATA3 drive bays
6. Up to 2200W Redundant Power Supplies   Titanium Level (96%)


Product SKUs

SYS-2029TP-HTR	SuperServer 2029TP-HTR (Black)


Motherboard

Super X11DPT-PS


Processor/Cache (per Node)

CPU	Dual Socket P (LGA 3647) Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s Support CPU TDP 70-165W with IVR
Cores	Up to 28 Cores with Intel® HT Technology


System Memory (per Node)

Memory Capacity	16 DIMM slots Up to 2TB ECC 3DS LRDIMM, 2TB ECC RDIMM, DDR4 up to 2666MHz
Memory Type	2666/2400/2133MHz ECC DDR4 SDRAM


On-Board Devices

Chipset	Intel® C621 chipset
SATA	SATA3 (6Gbps); RAID 0, 1, 5, 10 support
Network Controllers	Must bundle with at least one SIOM or network card per node
IPMI	Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Graphics	ASPEED AST2500 BMC


Input / Output (per Node)

SATA	6 SATA3 (6Gbps) ports
LAN	1 RJ45 Dedicated IPMI LAN port
USB	2 USB 3.0 ports (rear)
VGA	1 VGA port
Serial Port / Header	1 Fast UART 16550 port / 1 Header (internal)
Others	2 SATADOM support on the motherboard


System BIOS

BIOS Type	AMI 32MB SPI Flash ROM


Management

Software	Intel® Node Manager IPMI 2.0 KVM with dedicated LAN NMI SSM, SPM, SUM SuperDoctor® 5 Watchdog
Power Configurations	ACPI Power Management


PC Health Monitoring

CPU	Monitors for CPU Cores, Chipset Voltages, Memory. 5+1 Phase-switching voltage regulator
FAN	Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors
Temperature	Monitoring for CPU and chassis environment Thermal Control for fan connectors
Omni-Path Fabric CPUs	Do not support


Chassis

Form Factor	2U Rackmount
Model	CSE-217HQ+-R2K20BP3


Dimensions and Weight

Width	17.25" (438mm)
Height	3.47" (88mm)
Depth	28.5" (724mm)
Weight	Gross Weight: 90 lbs (40.9kg) Net Weight: 72 lbs (32.7 kg)
Available Colors	Black


Front Panel

Buttons	Power On/Off button UID button
LEDs	Power status LED HDD activity LED Network activity LEDs Universal Information (UID) LED


Expansion Slots (per Node)

PCI-Express	2 PCI-E 3.0 x16 Low-profile slots 1 SIOM card support Note: Must bundle with Network Card (With only one CPU installed, SXB2 M.2 and SXB4 riser card slots not function)


Drive Bays (per Node)

Hot-swap	6 Hot-swap 2.5" SATA3 drive bays


System Cooling

Fans	4 Heavy duty 8cm PWM fans with optimal fan speed control


Power Supply
2200W Redundant Power Supplies with PMBus
Total Output Power and Input	1200W with Input 100-127Vac 1800W with Input 200-220Vac 1980W with Input 220-230Vac 2090W with Input 230-240Vac 2200W with Input 220-240Vac (for UL/cUL use only) 2090W with Input 230-240Vdc (for CCC only)
AC Input Frequency	50-60Hz
Dimension (W x H x L)	76 x 40 x 336 mm
+12V	Max: 100A / Min: 0A (100-127Vac) Max: 150A / Min: 0A (200-220Vac) Max: 165A / Min: 0A (220-230Vac) Max: 174.17A / Min: 0A (230-240Vac) Max: 183.3A / Min: 0A (220-240Vac)
5VSB	Max: 1A / Min: 0A
Output Type	Backplanes (gold finger)
Certification	UL/cUL/CB/BSMI/CE/CCC Titanium Level [ Cert. in progress ]


Operating Environment

RoHS	RoHS Compliant
Environmental Spec.	Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing)


Parts List - (Items Included)

	Part Number	Qty	Description
Motherboard / Chassis	MBD-X11DPT-PS CSE-217HQ+-R2K20BP3	4 1	Super X11DPT-PS Motherboards 2U Chassis
Backplane	BPN-ADP-6SATA3P	4	Backplan adapter card; 6SATA ports,RoHS/REACH,PBF
Backplane	BPN-SAS3-217HQ2	1	2U 24-Port 4-Node Backplane Supports 6x2.5\" SAS3/SATA3 HDD/SSD per Node
Air Shroud	MCP-310-21707-0B	4	SC217HQ+ TwinPro 2pcs air shroud set for X11 DPT-PS
Riser Card	RSC-P-6	4	RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),RoHS
Riser Card	RSC-R1UTP-E16R	4	1U RHS TwinPro Riser card with one PCI-E x16 slot
Heatsink / Retention	SNK-P0067PS	4	1U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism
Heatsink / Retention	SNK-P0067PSM	4	1U Passive CPU Heat Sink with a 26-mm Wide Middle Air Channel for X11 Purley Platform Equipped with a Narrow Retention Mechanism
Power Supply	PWS-2K20A-1R	2	1U 2200W Redundant, Titanium, 76(W) X 40(H) X 336(L) mm


Optional Parts List

	Part Number	Qty	Description
TPM security module (optional, not included)	AOM-TPM-9670V	1	SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
TPM security module (optional, not included)	AOM-TPM-9670H	1	SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor
TPM security module (optional, not included)	AOM-TPM-9671V	1	SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor
TPM security module (optional, not included)	AOM-TPM-9671H	1	SPI capable TPM 1.2 with Infineon 9670 controller with horizontal form factor
Add-on-Card	AOC-SMG3-2H8M2	-	AOC supports 2280 M.2 form factor SSD (1 NVMe or 2 SATA)
SuperCap Kit	BTR-CV3108-TP2	-	Broadcom 3108 CacheVault kit for TwinPro
Software	SFT-OOB-LIC	1	OOB Management Package (per node license)
Software	SFT-DCMS-Single	1	DataCenter Management Package (per node license)

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