Catalogo
SCHEDA PRODOTTO
Cod./Produtt.: MSJ6813/MBD-X11DPi-NT-O
Produttore: SUPERMICRO
Descrizione: SRW - DP - Xeon LGA3647, 2 UPI up 10.4GT/s, TDP up 205W, Chipset C622, 16xDDR4 2666MHz up to 2TB ECC REG, PCIe: 4(x16 3.0) - 2(x8 3.0), 2(NVME PCIe 3.0), 1 M2 NVME/SATA3, LAN: 2 x 10GbE (Intel X557) RJ45, 14xSATA3 Raid 0, 1, 5, 10, VGA, IPMI2.0 su
SPECIFICHE TECNICHE

Key Features
  1. Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s, CPU1: Skylake-F CPU supported
  2. Intel® C622
  3. Up to 2TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
  4. 4 PCI-E 3.0 x16,
    2 PCI-E 3.0 x8
    M.2 Interface: PCIe 3.0 x4
    M.2 Form Factor: 2260, 2280, 22110,
    2 PCI-E 3.0 NVMExpress x4 Internal Port(s)
  5. 1 VGA port(s)
  6. Intel® C622 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  7. Dual LAN with 10GBase-T with Intel® X722 + X557
 
 
Product SKUs
MBD-X11DPi-NT
  • X11DPi-NT
 
Physical Stats
Form Factor
  • E-ATX
Dimensions
  • 12" x 13" (30.48cm x 33.02cm)
 
Processor/Cache
CPU
  • Intel® Xeon® Scalable Processors.
  • Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
  • CPU1: Skylake-F CPU supporte
Cores / Cache
  • Up to 28 cores
 
System Memory
Memory Capacity
  • Up to 2TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
Memory Type
  • 2666/2400/2133MHz ECC DDR4 RDIMM, LRDIMM
DIMM Sizes
  • RDIMM: 64GB
  • LRDIMM: 64GB
  • 3DS LRDIMM: 128GB
Memory Voltage
  • 1.2V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
 
On-Board Devices
Chipset
  • Intel® C622
SATA
  • Intel® C622 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
IPMI
  • ASPEED AST2500
Network Controllers
  • Dual LAN with 10GBase-T with Intel® X722 + X557
Graphics
  • Aspeed AST2500 BMC
 
Input / Output
USB
  • 2 USB 2.0 ports (2 rear),
  • 5 USB 3.0 ports (2 rear + 2 via header(s) + 1 Type A)
Video Output
  • 1 VGA port(s)
Serial Port / Header
  • 2 COM Ports (1 rear, 1 header(s))
TPM
  • 1 TPM Header
Expansion Slots
PCI-E
  • 4 PCI-E 3.0 x16,
  • 2 PCI-E 3.0 x8
M.2
  • Interface: PCIe 3.0 x4
  • Form Factor: 2260, 2280, 22110
 
System BIOS
BIOS Type
  • AMI UEFI
 
Management
Software
  • Intel® Node Manager, IPMI2.0, KVM with dedicated LAN, SPM, SSM, SUM, SuperDoctor® 5, Watchdog
 
PC Health Monitoring
Voltage
  • +1.8V, +12V, +3.3V, +5V, +5V standby
FAN
  • 8x 4-pin fan headers (up to 8 fans), Pulse Width Modulated (PWM) fan connectors, PWM fan speed control
Temperature
  • N/A
LED
  • N/A
Other Features
  • Chassis intrusion detection, CPU thermal trip support for processor protection, Node Manager Support, RoHS
 
Operating Environment
Operating Temperature Range
  • 0°C ~ 50°C (32°F ~ 122°F)
Non-Operating Temperature Range
  • -20°C ~ 60°C (-4°F ~ 140°F)
Operating Relative Humidity Range
  • 10% ~ 85% (non-condensing)
Non-Operating Relative Humidity Range
  • 10% ~ 95% (non-condensing)