Intel Xeon D-1700 processors with the highly integrated design is packaged as a system-on-chip (SoC) based on a ball grid array (BGA) package, which are designed for provisioning dense compute at the edge that balances high computational throughput with low thermal design power (TDP). High per-core performance, advanced security features, and built-in hardware acceleration for crypto, AI, and compression support the requirements of demanding workloads within a density-optimized platform.

The platform that are optimized for edge computing and other distributed environments are enabling the push of data center resources outward, for implementations and use cases such as:

Networking

including gateways and routers, security appliances, and storage

5G Topologies

including C-RAN and D-RAN architectures

Security

including Secure Access Service Edge (SASE)

IoT

including smart operations