F629P3-RC0B



Integrated Board
Super X11DPFR-SN
 
Key Features
4 Hot-plug System Nodes in 4U
Each node supports:

1. Dual socket P (LGA 3647) supports
    Intel® Xeon® Scalable Processors,
    Dual UPI up to 10.4GT/s
2. Up to 1.5TB ECC 3DS LRDIMM, up to
    DDR4-2666MHz; 12 DIMM slots
3. Expansion slots: 1 PCI-E 3.0 x16 (LP)
    1 PCI-E 3.0 x16 (for SIOM )
4. SIOM Network card,
    1 dedicated IPMI LAN port
5. 1 VGA, 2 USB 3.0 ports
6. 8 Hot-swap 3.5" SAS3/SATA3 or
    6 Hot-swap 3.5" SAS3/SATA3 +
    2 optional NVMe U.2
7. SAS3 via Broadcom 3008
8. 2x 8cm 14k RPM middle fans
9. 1200W Redundant Power Supplies
    Titanium Level (96% Efficiency)
 

Product SKUs
SYS-F629P3-RC0B
  • SuperServer F629P3-RC0B (Black)
 
Motherboard

Super X11DPFR-SN
 
Processor/Cache
CPU
  • Dual Socket P (LGA 3647)
  • Intel® Xeon® Scalable Processors,
    Dual UPI up to 10.4GT/s
  • Support CPU TDP 70-165W with IVR
Cores
  • Up to 28 Cores with Intel® HT Technology
 
System Memory
Memory Capacity
  • 12 DIMM slots
  • Up to 1.5TB ECC 3DS LRDIMM, 1.5TB ECC RDIMM, DDR4 up to 2666MHz
Memory Type
  • 2666/2400/2133MHz ECC DDR4 SDRAM
 
On-Board Devices
Chipset
  • Intel® C621 chipset
SAS
  • SAS3 (12Gbps) via Broadcom 3008
Network Controllers
  • Flexible networking via SIOM
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Graphics
  • ASPEED AST2500 BMC
 
Input / Output (per node)
SAS
  • 8 SAS3 (12Gbps) ports
NVMe
  • 2 NVMe U.2 option
LAN
  • SIOM flexible Network card
  • 1 RJ45 Dedicated IPMI LAN port
USB
  • 2 USB 3.0 ports (rear)
VGA
  • 1 VGA port
 
System BIOS
BIOS Type
  • 128Mb SPI Flash EEPROM with AMI BIOS
 
Management
Software
Power Configurations
  • ACPI Power Management
 
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory.
  • 4+1 Phase-switching voltage regulator
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 4U Rackmount
Model
  • CSE-F424AS2-R1K23BP
 
Dimensions and Weight
Width
  • 17.63" (448mm)
Height
  • 6.96" (177mm)
Depth
  • 29" (737mm)
Package
  • 28.3" (W) x 15.0" (H) x 42.4" (D)
Weight
  • Net Weight: 150 lbs (68.04 kg)
  • Gross Weight: 200 lbs (90.71 kg)
Available Colors
  • Black
 
Front Panel
Buttons
  • Power On/Off button
  • UID button
LEDs
  • Power status LED
  • Hard drive activity LED
  • Network activity LEDs
  • Information LED (UID, Fan failure, Overheat)
 
Expansion Slots (per node)
PCI-Express
  • 1 PCI-E 3.0 x16 (Low-profile)
  • 1 PCI-E 3.0 x16 (SIOM)
 
Drive Bays (per node)
Hot-swap
  • 8 Hot-swap 3.5" SAS3/SATA3 or 6 Hot-swap 3.5" SAS3/SATA3 + 2 optional NVMe U.2
M.2
  • M.2 Support
 
Backplane
1 SAS/SATA backplane
 
System Cooling (per node)
Fans
  • 2x 8cm 14 RPM middle fans
 
Power Supply (76mm Width)
1200W Redundant Power Supplies with PMBus
Total Output Power
  • 1000W/1200W
Dimension
(W x H x L)
  • 76 x 40 x 336 mm
Input
  • 100-127Vac / 15-12A / 50-60Hz
  • 200-240Vac / 8.5-7A / 50-60Hz
  • 200-240Vdc / 8.5-7A (for CCC only)
+12V
  • Max: 83A / Min: 0A (100-127Vac)
  • Max: 100A / Min: 0A (200-240Vac)
  • Max: 100A / Min: 0A (200-240Vdc)
+5Vsb
  • Max: 4A / Min: 0A
Output Type
  • 19 Pairs Gold Finger Connector
Certification Platinum Level Certified95%+
 UL/cUL/CB/BSMI/CE/CCC
Titanium Level
  [ Test Report ]
 
Operating Environment
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature:
       -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity:
       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
       5% to 95% (non-condensing)
 
Parts List - (Items Included)
 
 Part Number
 Qty
 Description
Motherboard / Chassis MBD-X11DPFR-SN
CSE-F424AS2-R1K23BP		 4
1		 Super X11DPFR-SN Motherboard
4U Chassis
Backplane BPN-ADP-8S3008-1UF 4 BPN-ADP-8S3008-1UF
Backplane BPN-ADP-X11DPFR 4 Power distribution board for X11DPFR-S(N)
Backplane BPN-SAS3-F424-A2N2A 4 2-Port Hybrid Backplane support 2 x SAS3/SATA3/NVMe Storage Devices
Backplane BPN-SAS3-F424-A6 4 6-port Fat Twin SAS3 12Gbps backplane, support up to 6x 3.5-inch SAS3/SATA3 HDD/SSD
Cable 1 CBL-0486L 12 2x2 to 2x2 15cm power cable HF. 18AWG
Cable 2 CBL-OTHR-0022L 4 20 to 20 pin cable for BPN-ADP-F418LS,7.5cm, 28AWG,RoHS/REACH,PBF
Cable 3 CBL-SAST-0691 4 MINI SAS HD RA- 2x MINI SAS HD,INT,15/59CM,28AWG
Cable 4 CBL-SAST-0706 4 MINI SAS HD (reversed RA)-MINI SAS HD,12G,INT,11CM,30AWG
Heatsink / Retention SNK-P0068PSC 4 2U Passive CPU Heat Sink with a Side Air Channel for X11 Purley Platform Equipped with a Narrow Retention Mechanism
Heatsink / Retention SNK-P0069PSC 4 1.5U Proprietary 50-mm Tall Passive CPU Heat Sink with a Side Air Channel for X11 Purley Platform 2U Node Twin Series Servers
Power Supply PWS-1K23A-1R 4 AC-DC 1200W, Titanium Level, Redundancy, 1U, PMBUS 1.2, +12V/+5Vsb, 360x76x40 mm,HF,RoHS/REACH

 
Optional Parts List
  Part Number Qty Description
Backplane BPN-ADP-2UPWR-X11 - 1 per node for configurations with CPU at 145W or higher
Cable CBL-0480L - 1 per node for configurations with CPU at 145W or higher
NVMe - - Contact Supermicro for configurations with more NVMe SSDs.
Software SFT-OOB-LIC 1 OOB Management Package (per node license)
Software SFT-DCMS-Single 1 DataCenter Management Package (per node license)