Intel Xeon D-1700 processors with the highly integrated design is packaged as a system-on-chip (SoC) based on a ball grid array (BGA) package, which are designed for provisioning dense compute at the edge that balances high computational throughput with low thermal design power (TDP). High per-core performance, advanced security features, and built-in hardware acceleration for crypto, AI, and compression support the requirements of demanding workloads within a density-optimized platform.
The platform that are optimized for edge computing and other distributed environments are enabling the push of data center resources outward, for implementations and use cases such as:
including gateways and routers, security appliances, and storage
including C-RAN and D-RAN architectures
including Secure Access Service Edge (SASE)
including smart operations
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Key Features per system |
Entry Level Virtualization
Basic Storage Server
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|---|---|
| Form Factor | W x H x D : 310 x 200 x 270 mm |
| Drive Bays ext | - |
| Drive Bays int | 2 x 2,25" |
| HDD | 4 x 3,5"/2,5" SAS3/SATA (12G) Hot Swap |
| Power Supply | 650W Single PSU Gold Level |
| Rail Kit | - |
| Processor | up to 1 Intel® Xeon® D-1739 |
| Chipset | System on Chip |
| Memory slots | 4 x DDR4 2933 MHz. ECC Reg |
| Expansion slots | 1 PCI-E 5.0 x16 |
| Controller | Optional via AOC |
| NVMe Ports | 1x M2 PCIe 3.0 x4 |
| Remote Management | 1 x shared LAN with IPMI |
| LAN On-Board | 2 x Gigabit Ethernet ports (RJ45) |
| Input/Output | 1 USB 3.2, 1 VGA, 1 COM port |
| Garanzia | 3 anni On-center - (Estensione a 3 anni ON-SITE opzionale) |